Bondgen

What is Bondgen?

No IC package is assembled without a tres to the factory. Generating and verifying this design is usually a bottleneck in the packaging manufacturing process.

Artwork developed the BONDGEN program to speed up and simplify the generation of bond cable documentation.

BONDGEN has been specifically designed to produce a DWG file that is LPO compatible (The ff L ine P ROGRAMMing) with Kulicke and Soffa wire Bonders, ESEC, ASM and Kaijo. For manually programmed wire fasteners, BONDGEN creates a multiple-page print with each strand of wires clearly defined.

Flash Tutorials

Exporting AIF from APD - Describes how to export an AIF file from cadence APD/SIP that will be used by Bondgen to create the link document.

Importing AIF to Bondgen Part I - How to select the AIF file; marking where the wires fall into the rings; labeling the bond fingers.

Importing AIF to Bondgen Part II - Separating wires by link layer. Running wire DRC.

Importing AIF to Bondgen Part III - Extracting data about the package; uploading a model to the edge of the title; noting the edge of the title.

Creating an empty skin with a new BGA design - For designers who want to reuse a BGA design for a new array, the first step is to create a marked empty package.

Direct connection to Cadence APD / SIP

Package designers who use Cadence's Advanced Package Designer can interface directly with BONDGEN using a SKILL-based interface that writes the AIF file format. Embedded in the AIF file is the location, number, and size of each array block and each finger. Ring geometry is also included. Using the data from the AIF file, Bondgen creates an AutoCAD drawing. The drawing positions the wires in the exact coordinates of the APD design database.

Upd (formerly ENCORE BGA) and Cadence APD now include AIF Export as a standard resource.

Marking

Bondgen labels the fingers showing the finger number and the JEDEC ball to which it is connected. This is one of the most time-consuming aspects of creating a little. Many package layout tools have limited ability to do this type of labeling.

Summary data

Bondgen calculates the total length of the wire, the maximum and minimum length of the wire; crucial information for the assembly engineer.

Classification of wires by levels

Bondgen can separate the wires and segregate each "layer" into its own AutoCAD layer. This is required for PLO compatibility.

DRC Wire

Bondgen checks the spacing, length, and angle of each wire relative to the design rules. Errors are flagged for review.

Edge / Auto Title Annotation

Bondgen can pick up your full drawing, drop a title border and help you fill in the fields in seconds. Easily customizable for your company requirements.

Auto plotting

Bondgen helps you automatically generate the plot sheets needed for your released package.

Data Extraction

Bondgen can extract useful information such as the list of balls that go to power and ground nets or longer and shorter wire lengths.

Bondgen tec file format

Describes the syntax and content of the Bondgen tec file format used to specify layers, colors.

System requirements:

CPU: 1.8 GHz dual core processor

RAM: 2 GB

HDD / SSD: 50 GB of free space on the main drive

Operating system: Microsoft Windows 8 32-bit, Microsoft Windows 7 32-bit and Microsoft Windows Vista 32-bit

Resolution: 1024×768