Semiconductors

What is Semiconductors?

Continuous advances in semiconductor technology enable transformational products for artificial intelligence, machine learning, 5G, automotive, networking, cloud, and cutting-edge computing applications. Ubiquitous connectivity, low latency, and faster data rates enable billions of smart devices. These devices feature advanced low-power FinFET designs and state-of-the-art 2.5D /3D integrated circuit (IC) encapsulation technologies to deliver the required power, performance, area, and reliability goals.

Because designers adopt advanced process technologies and very dense 2.5D/3D packaging techniques, the impacts of an ever-increasing set of physical effects need to be considered when verifying chip performance and reliability. Semiconductors has developed a broad and deep set of multiphysical products to accurately analyze energy integrity, thermal, variability, electromagnetic, mechanical and other physics in a way that captures its complex interdependencies across the chip spectrum, package and system to promote initial silicon and system success.

System-aware IC power efficiency, power integrity and reliability

At the heart of each electronic system is a chip that must meet various conflicting requirements such as high performance, increased functionality, power efficiency, reliability and low cost. Ensuring that the chip meets the requirements of energy efficiency, power integrity, and reliability both as an independent component and within the electronic system requires a system-aware chip design methodology.  Semiconductors exclusively offers a set of multiscale and multiphysics solutions to support a chip packet system (CPS) design flow.

Semiconductors have the Ansys simulation and modeling tools that provide you with an initial energy budget analysis for high-impact, precision-certified design decisions required for IC approval. Ansys semiconductor portfolio of energy efficiency, energy integrity and reliability solutions achieves ISO 26262 "Tool Confidence Level 1" (TCL1) certification. This certification enables automotive IC designers to meet stringent safety requirements for ADAS and standalone applications. Automotive chip makers can leverage the Ansys PowerArtist, Ansys Totem, and Ansys RedHawk multi-physical simulation family for all ISO 26262 safety-related development projects at any level of automotive safety integrity.

Elastic computing with distributed Big Data infrastructure

Chip complexity continues to increase to one billion instances and beyond, while advanced silicon technology at 7nm/5nm and below requires increasingly accurate accuracy with more detailed modeling. Ansys responded by developing the Ansys SeaScape elastic computing infrastructure for use by RedHawk-SC and the other core tools in the semiconductor portfolio. The SeaScape infrastructure is based on the big data approach to computing used in machine learning applications, in this case optimized for electronic design. It offers unlimited elastic computing and parallel processing for extremely high capacity and throughput. The flexible Python interface makes it easy to unify and analyze data from multiple physics in a single visualization.

Precision certified by casting

Designing chips with advanced silicon processes has become extremely expensive, and the first use of silicon is a necessity. IC designers demand the most accurate simulation solution and consider casting certification to be the ultimate proof of accuracy. Ansys semiconductor solutions have been certified by all leading foundries since 2006.

Proven production solutions

The software has enabled thousands of successful tape-outs in various technology nodes, design styles and packaging technologies.

System requirements:

CPU: 1.8 GHz dual core processor

RAM: 2 GB

HDD / SSD: 50 GB of free space on the main drive

Operating system: Microsoft Windows 8 32-bit, Microsoft Windows 7 32-bit and Microsoft Windows Vista 32-bit

Resolution: 1024×768